Ceramic Heat Sink
Features：
- Good insulation and high thermal conductivity.
- Large infrared emissivity and low expansiion.
- Can withstand high current and high voltage and leak-proof.
- Multi-directional heat dissipation.
- small, light and does not take up space.
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Features：
- Good insulation and high thermal conductivity.
- Large infrared emissivity and low expansiion.
- Can withstand high current and high voltage and leak-proof.
- Multi-directional heat dissipation.
- small, light and does not take up space.
Production information
Imformation
Feature
•Ceramic materials have the characteristics of good insulation, high thermal conductivity, large infrared emissivity, and low expansion coefficient. They can be used as new materials for heat dissipation of LED lighting and network communication products.
•Can withstand high current, high voltage, leak-proof, no noise, no coupling parasitic capacitance with MOS and other power tubes, and therefore simplify the filtering process; the creepage distance required is shorter than that required by financial institutions It saves board space and facilitates the design and electrical certification of engineers.
•The multi-directional heat dissipation is more suitable for the IC packaging method of multi-directional heat dissipation.
•The material is small in size, light in weight, does not take up space, and is more conducive to the rational layout of the product design.
•Good heat dissipation and heat transfer performance can effectively solve the heat dissipation problem of electronic products and power components and prolong the service life of
•As a green environmental protection material, the product is mainly used in LED lighting and related electronics industries. Ceramic products can effectively solve the problems of heat conduction and heat dissipation in the electronics and optoelectronic industries, and provide technical support and breakthroughs for the innovation and development of electronic products. It is suitable for IC, MOS, triode, Schottky, IGBT and other surface heat sources that need heat dissipation. It is especially suitable for low wattage power consumption, and it is particularly light, thin, short and small in design space.
Feature
•Ceramic materials have the characteristics of good insulation, high thermal conductivity, large infrared emissivity, and low expansion coefficient. They can be used as new materials for heat dissipation of LED lighting and network communication products.
•Can withstand high current, high voltage, leak-proof, no noise, no coupling parasitic capacitance with MOS and other power tubes, and therefore simplify the filtering process; the creepage distance required is shorter than that required by financial institutions It saves board space and facilitates the design and electrical certification of engineers.
•The multi-directional heat dissipation is more suitable for the IC packaging method of multi-directional heat dissipation.
•The material is small in size, light in weight, does not take up space, and is more conducive to the rational layout of the product design.
•Good heat dissipation and heat transfer performance can effectively solve the heat dissipation problem of electronic products and power components and prolong the service life of
