Thermal Conductive Gel Pad
The product undergoes a specialized manufacturing process, resulting in excellent flexibility and compressibility. Its gel-like sheets allow for a compression rate of up to 50%, enabling a perfect fit for gaps between various electronic components. It is less affected by environmental changes, ensuring effective heat dissipation. It is suitable for applications requiring tight contact and efficient heat dissipation.
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Compression rate: 50%
Excellent self-adhesion
High voltage resistance
Low oil content
